Prof. Yosi Shacham-Diamand, The Bernard L. Schwartz chair for nano scale information technologies, Department of Electrical Engineering - Physical electronics and the department of Material science and technology, Faculty of engineering, Tel Aviv University. D.Sc. EE 1983, M.Sc. EE 1980, and B.Sc. EE (Summa-cum Laude) 1978, all in the Technion-Israel Institute of Technology, Haifa, Israel. 1983-post-doctorate at U.C. Berkeley, CA, USA. 1987- 1989 senior lecturer, the Technion, Israel. 1989-1996 assistant professor Cornell university, Ithaca NY, USA, 1997-2001 Associate professor and since 2001 a full professor at the school of electrical engineering, Physical Electronics department, Tel-Aviv University. Yosi has been also a Visiting professor, CNR-IMM, Rome, Italy, Visiting Professor, Waseda University, Tokyo, Japan and a distinguished international chair professor, Feng Chia University, Taichung, Taiwan.
He served in few academic position including being the Academic Director, Micro Technologies Laboratory, Faculty of Engineering, Tel-Aviv university (2000 –2001), the director of Tel-Aviv University research institute for Nano-Science and nano-technologies (2001–2004), Head of the department of Physical Electronics, faculty of Engineering (2007- 2011), the Vice-dean of the faculty of engineering for Industrial relations and with the friends of the faculty in Israel and abroad. He was on the university board of governors (2008-2012), University patent committee (2006-2010), head of the industrial affiliation program, Faculty of engineering (2012) and a Member of the board of directors of "RAMOT" by Tel Aviv University (2008-2013). He is a Member of the MAGNET committee promoting basic and generic technologies in Israel, the innovation authority, Ministry of trade and Industry.
He published 227 journal papers, >400 conference papers in registered proceedings, 7 chapters in books, 30 patents, edited two conference proceedings books, and two books. His research is in the field of Micro and Nano electronics science and technology:
1) Micro and Nano scale Metallization:
- a) Electroless plating of metals and alloys,
- b) Interconnect technology for ULSI circuits and flexible electronics,
- c) Bio electrochemical electrodes.
2) Electrochemical bio sensors the food, medical and agro applications.
- a) Nano particle based sensors
- b) Whole cell sensors